multilayer ceramic chip capacitors 1 of 3 creation date : november 16, 2017 (gmt) cga4j3x7r1c475m125ae tdk item description cga4j3x7r1c475mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga4(2012) [eia 0805] status production size length(l) 2.00mm +0.45,-0.20mm width(w) 1.25mm +0.25,-0.20mm thickness(t) 1.25mm +0.25,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 4.7f 20% rated voltage 16vdc temperature characteristic x7r(15%) dissipation factor (max.) 7.5% insulation resistance (min.) 21m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 16, 2017 (gmt) cga4j3x7r1c475m125ae characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga4j3x7r1c475m125ae esr cga4j3x7r1c475m125ae capacitance cga4j3x7r1c475m125ae dc bias characteristic cga4j3x7r1c475m125ae temperature characteristic cga4j3x7r1c475m125ae(no bias) cga4j3x7r1c475m125ae(dc bias = 8v) ripple temperature rising cga4j3x7r1c475m125ae(100khz) cga4j3x7r1c475m125ae(500khz) cga4j3x7r1c475m125ae(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 16, 2017 (gmt) cga4j3x7r1c475m125ae associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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